設備正壓/Positive Pressue (Kpa)

0.4~0.6

設備負壓/Negative Pressure (-Kpa)

0.1~0.4

設備總功率/Total Power(KW)

2.5kw

硅片厚度 /Wafer Thickness(μm)

100~400

產能/小時(理論值)/Capacity/ hour（theoretical value）

單臺印刷機/Singel printer:1100(1200)

雙拼印刷機/Double printer:2000(2200)

三拼印刷機: Three layer printer：2800(3100)

印刷精度/Printing Accuracy(mm)

±0.025

運輸方式

Transportation

采用彈性皮帶運輸

Elastic belt transport

運輸更平緩,柔和.可以減少類似像卡位騎馬式運輸硬接觸所帶來硅片破碎率

Transport steady. Can reduce wafer broken rate arising from transport hard contact.   

刮刀下降方式

Scraper way down

步進馬達+氣缸

Stepper motor + Cylinder

采用步進馬達+氣缸方式,無需手動調節(jié)刮刀印刷高度,只需在軟件里調節(jié),更方便.而且可以根據(jù)絲網的張力變化,根據(jù)經驗值,讓刮刀的下降值跟隨絲網的變化值,更實用.

Use  stepper motor and cylinder, no need manual adjustment of squeegee  printing height, only adjust on the software, more convenient. According  to changing of screen tension and empirical value, descend value of squeegee will follow screen change, more practical.

印刷方式

Printing

采用雙邊驅動

Bilateral driver

采用雙邊龍門式驅動印刷,可以印刷更平穩(wěn).

Bilateral gantry type driver printing, more stable.

取像方式

Take photo

采用四相機照取硅片邊緣

Take photo for wafer edge  by 4 cameras

采用四相機照取硅片邊緣,可以減小硅片尺寸誤差所帶來印刷偏向問題,從而可以更好地為雙印刷提供保證

Take  photo for wafer edge by 4 cameras can avoid printing deviation problem  caused by wafer size error, that could be ensured double printing  effect.

調整方式

Adjustment

平臺調整方式,非絲網調整

Platform adjustment mode, non-screen adjustment

調整平臺可以更有效地保證柵線印刷的一致性

Adjust platform can ensure consistency of grid line printing effectively.