產品詳細
整機參數/ Machine Specifications:
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設備外形尺寸/Equipment Dimensions (mm)
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WxLxH:1000x1300x1600
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設備正壓/ Positive Pressue (Kpa)
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0.4~0.6
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設備負壓/Negative Pressure (-Kpa)
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0.1~0.4
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設備總功率/Total Power (KW)
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1.5kw
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技術參數/Technical Specifications:
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硅片尺寸/Wafer Size (mm)
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125x125,156x156,210x210
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硅片厚度/Wafer Thickness (μm)
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100~400
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產能/小時/Capacity/ hour
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3000
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印刷精度/Printing Accuracy (mm)
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±0.025
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技術特點/Features:
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具體細項/Item
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控制方式/Control mode
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體現優點/Advantage
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放板方式
Place the board
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整疊硅片放在固定冶具中
Place whole stack of wafer in the jig
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可以一次性放大量硅片,而且無需人為插件或是專門設備進行插件.可以減少人為因素或是設備成本.
Can place a large number of wafers on one-time, no need plug-in by manual mode or plug-in by specialized equipment. Reduce personal factor or equipment cost.
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取板方式
Put out the board
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同步吸取與放置
Absorb and place synchronously
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同步吸取與放置:當一邊放置硅片到運輸軌道時,另一邊同時在吸取硅睡,這樣沒有浪費中間的控制時間,可以更快速的吸取硅片,提高產能.
When one side place wafer on the conveyor, another side absorb wafer at the same time. Save control time, absorb wafer faster, increase production capacity.
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