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Computer Controlled Class 100 Ion Beam Etch System for up to 6” Wafer

-- PC controlled with Lab View Software, recipe driven, pressure, fully interlocked, capable of running automatically and recovering safely from power interruption.

--Password protected three levels of Authorization
--Chamber: 14” Stainless Steel cube, and 8” front door with 5” window
--Substrate Platen: Up to 6” substrates, two independent axis of rotation platen axis (0-90) stepper motor driven, wafer axis (0-10RPM) HVAC stepper motor driven, water cooled
--Wafer Load Unload: Manual, from the front door
--Ion Gun: 16cm beam diameter, 1200 eV, 650 mA ion gun, with neutralizer and a pneumatic shutter
--Vacuum: Base Pressure 8x10-8 Torr, 1240l/sec Pfeiffer Hipace 1200 Turbo with ISP-500C Dry Scroll pump,
--Gauges : BOC Edwards wide range gauge, Baratron Gauge
--Flow Control: 50 sccm MKS Ar MFC
--Pressure Control: Turbo Speed Control
--Chamber Vent: N2 Slow vent with turbo speed monitor
--Chamber Pump Down: PC Controlled, safety interlocked
--Cabinet:26”x26”x44” Stainless Steel
--Utilities: 415VAC, 20A/Phase, 50/60Hz, Chilled Water 4 G/min at 40 Psi, 60