田村 tamura 低銀錫膏GP-216-HF17  衡鵬企業(yè)為您供應(yīng)


LFSOLDER GP-216-HF17 is a Pb-free and cleaning-free
Table 1 Characteristics
Fig.1 SEM photograph of solder powder
solder paste used Pb-free spherical solde powder and
flux. Since this solder paste contains no Pb, the usage of
hazardous materials is reduced, furthermore, the
and the safe workplace are protected. As its flux residue
contains no halides, it can be remained on the PCB
　 heater and conveyor during reflowing.
　 temperature.
● Superior reliability is provided by no washing.
● Stable printability with little change in viscosity
?? during continuous printing.
● Pb-free (Sn/Ag/Cu series) solder alloy is used.
● Excellent wettability for electronic component and land p
● Having a good solderability even in air reflow.
● Excellent solderability can be attained for a high peak
2.Outstanding features
cleaning.


Items                    Characteristics                    Test methods
Alloy composition      Sn96.8/Ag0.3/Cu0.7/Bi2.0/In0.2       JIS Z 3282??1999
Melting point          210??224??                           According to DSC
Particle size of
solder powder          20-36μm                            According to laserdiffraction method
Flux content           12.5%                                JIS??Z??3284 (1994)
Chlorine content       0.0??                                JIS??Z??3197??(1999)
Viscosity              200Pa??s                             Annex 6 to JIS Z
3284 (1994)